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| 2 PACKAGING INFORMATION 300-mil Plastic SOJ Package Code: J N ISSI (R) E1 E 1 D A SEATING PLANE B A2 C e b A1 E2 MILLIMETERS Sym. Min. Typ. Max. INCHES Min. Typ. Max. Notes: 1. Controlling dimension: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Rev. D 02/25/03 PACKAGING INFORMATION 300-mil Plastic SOJ Package Code: J ISSI (R) MILLIMETERS Sym. Min. Typ. Max. INCHES Min. Typ. Max. Sym. MILLIMETERS Min. Typ. Max. INCHES Min. Typ. Max. 2 Rev. D 02/25/03 PACKAGING INFORMATION Plastic TSOP - 28-pins Package Code: T (Type I) 1 ISSI (R) E H N D SEATING PLANE S A e B L A1 C Symbol Ref. Std. No. Leads A A1 B C D E H e L Plastic TSOP (T--Type I) Millimeters Inches Min Max Min Max 28 1.00 1.20 0.05 0.20 0.16 0.27 0.10 0.20 7.90 8.10 11.70 11.90 13.20 13.60 0.55 BSC 0.30 0.70 0 5 0.037 0.047 0.002 0.008 0.006 0.011 0.004 0.008 0.308 0.316 0.456 0.465 0.515 0.531 0.022 BSC 0.011 0.027 0 5 Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. PK13197T28 Rev. B 01/31/97 |
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